YRM10 | Compact High-Speed Modular Mounter for Flexible SMT Production
YRM10 | Compact High-Speed Modular Mounter for Flexible SMT Production
Product Description
The YRM10 is a next-generation compact high-speed modular mounter that redefines cost-performance in the 1-beam, 1-head class. Announced in early 2024, it packs the advanced technology of Yamaha‘s high-end YRM series into a “just right” small, multi-purpose platform. Designed for electronics manufacturers seeking high productivity within limited floor space, the YRM10 achieves an impressive 52,000 CPH mounting capability, the world’s fastest in its class. Its high-speed multi-purpose in-line head handles an exceptionally broad component range, from ultra-small 0201 chips to large components up to 100 × 55 mm, eliminating the need for head changeovers and maximizing production efficiency. With a compact footprint (L1,254 × W1,440 × H1,445 mm), the YRM10 is ideal for SMT lines, R&D labs, and small-batch manufacturers requiring both flexibility and high-quality, defect-free production.
Key Features
World-Class Speed & Productivity: Delivers 52,000 CPH (under optimized conditions), the fastest mounting performance in the 1-beam, 1-head class.
Broad Component Coverage with Single Head: High-speed multi-purpose inline head supports components from 0201mm to L100 × W55mm (Height ≤15mm).
High Mounting Accuracy: Achieves ±0.035mm (Cpk≧1.0) placement accuracy for reliable, high-quality production of fine-pitch and micro-components.
Compact, Space-Saving Design: External dimensions of L1,254 × W1,440 × H1,445mm deliver high productivity per square meter.
Large Component Capacity: Handles up to 96 types of reel components (8mm tape feeder conversion) and up to 15 tray types (with optional sATS15R).
Advanced Quality Assurance: Features include side-view camera for detecting pickup anomalies, coplanarity checker for warped tray components, and automatic nozzle cleaning to maintain consistent quality.
User-Friendly Operation: Slim lightweight feeders, Auto Loading Feeder (ALF) for easy setup, and tool-less nozzle holder replacement simplify operation and reduce changeover time.
Seamless Integration: Optional SEMI SMT-ELS communication standards enable seamless auto program changeover with other manufacturers‘ equipment.
High-Precision, High-Quality: Setting the New Standard in Compact Depaneling
As electronics continue to evolve toward higher density, smaller form factors, and more irregular board geometries, conventional depaneling methods often fall short. DCT delivers an environmentally friendly, fast, precise, and reliab
le laser cutting solution—engineered to meet the demands of next-generation PCB assembly.
Stress‑Free Cutting
Even with components placed extremely close to the cut line, our laser process introduces zero mechanical stress, protecting sensitive parts and ensuring long‑term reliability.
Precise Thermal Management
We match laser type and processing parameters to the thermal characteristics of each board, significantly reducing heat‑affected zones and preventing damage to adjacent components.
Clean, Contaminant‑Free Operation
During cutting, gases and ablation byproducts are extracted in real time, minimizing contamination risk and maintaining a clean assembly environment.
