YRM20DL | Dual Lane High-Efficiency Modular Mounter with 120,000 CPH Throughput
YRM20DL | Dual Lane High-Efficiency Modular Mounter with 120,000 CPH Throughput
Product Description
The YRM20DL is a super-high-efficiency dual-lane modular mounter that delivers exceptional productivity without compromising flexibility. Featuring a revolutionary “1 head solution,” it achieves a maximum mounting capability of 120,000 CPH (high-production mode), making it one of the fastest dual-lane machines in its class.The YRM20DL offers three interchangeable head types—Super High-Speed Rotary RM Head, High-Speed General-Purpose In-Line HM Head, and Odd-Shaped Components In-Line FM Head—allowing manufacturers to configure the system precisely for their production mix, from high-volume chip mounting to complex, large-component assembly.Its dual-lane conveyor system supports both single-use and dual-use PCB transport, maximizing throughput while maintaining a compact footprint of just L1,374 × W2,102 × H1,445mm.
Key Features
Ultra-High Dual-Lane Throughput: Delivers up to 120,000 CPH (with RM heads in high-production mode), doubling productivity within the same floor space compared to single-lane configurations.
Single Head Solution for Broad-Range Production: Three interchangeable head types provide comprehensive coverage—RM head for high-speed chip mounting to 12mm, HM head for large components up to 100 × 55mm, and FM head for odd-shaped and tall components up to 30mm height.
Exceptional Mounting Accuracy: High-precision mode achieves ±0.015mm (Cpk≧1.0) for micro-components, ensuring reliability for advanced electronics.
Versatile Dual-Lane Operation: Supports parallel mode (different boards on each lane), alternate mode (same board on both lanes), and hybrid mode for maximum productivity in mixed production environments.
Large Component Capacity: Handles up to 128 feeder types (with 8mm conversion) and up to 60 tray types (with eATS30 × 2).
Advanced Automation Features: Includes Auto Pin Changer, Auto Nozzle Station, Auto Loading Feeder (ALF) for non-skilled operation, and side-view camera for pickup anomaly detection.
Smart IT Options: Traceability function, material time limit management, dashboard for operating rate analysis, and Production Setup Verify for barcode-based component verification.
Low-Impact Mounting: PCB height measurement and low static-loaded nozzle control minimize impact on micro components during placement.
High-Precision, High-Quality: Setting the New Standard in Compact Depaneling
As electronics continue to evolve toward higher density, smaller form factors, and more irregular board geometries, conventional depaneling methods often fall short. DCT delivers an environmentally friendly, fast, precise, and reliab
le laser cutting solution—engineered to meet the demands of next-generation PCB assembly.
Stress‑Free Cutting
Even with components placed extremely close to the cut line, our laser process introduces zero mechanical stress, protecting sensitive parts and ensuring long‑term reliability.
Precise Thermal Management
We match laser type and processing parameters to the thermal characteristics of each board, significantly reducing heat‑affected zones and preventing damage to adjacent components.
Clean, Contaminant‑Free Operation
During cutting, gases and ablation byproducts are extracted in real time, minimizing contamination risk and maintaining a clean assembly environment.
