YSM40R | Ultra-High-Speed Modular Mounter with 200,000 CPH and 1m Width
YSM40R | Ultra-High-Speed Modular Mounter with 200,000 CPH and 1m Width

Product Description
The YSM40R is Yamaha‘s flagship ultra-high-speed modular surface mounter, designed to achieve revolutionary productivity on a remarkably compact platform. With the world-leading mounting capability of 200,000 CPH (under optimum conditions with RS heads) in a 4-beam, 4-head configuration, the YSM40R redefines what is possible for high-volume SMT production.Despite its immense throughput, the machine occupies a width of just 1,000 mm, allowing extremely short line configurations and high productivity per square meter.The YSM40R supports both ultra-high-speed RS heads for chip components (0201mm to 6.5mm square) and multi-purpose MU heads for larger components up to 45×100mm, providing a unique combination of speed and flexibility in a single platform.
Key Features
World-Leading 200,000 CPH Throughput: Mounting capability of 200,000 CPH (under optimum conditions with RS heads) sets a new standard for high-volume SMT production efficiency.
Ultra-Compact 1-Meter Width: Machine width of just 1,000 mm enables extremely short line configurations and doubles productivity per square meter when paired as a dual-line setup.
Flexible Head Configuration: Choose between Ultra-High-Speed RS heads (for 0201mm to □6.5mm components, height≤2.0mm) and Multi MU heads (for 03015mm to 45×60mm or 0402 to 45×100mm, height≤15/25.5mm).
High Mounting Accuracy: Achieves ±35μm (±25μm Cpk≧1.0) placement accuracy (under optimum conditions with RS heads), ensuring quality for high-density PCB assembly.
Large Feeder Capacity: Supports up to 80 feeders with all RS heads, 88 feeders with all MU heads, or 84 feeders with mixed RS/MU configurations (2+2).
Non-Stop Operation: Enables setup and changeovers during continuous production, especially when used with ZS feeders, minimizing downtime and maximizing line utilization.
Versatile Applicable PCB Range: Accommodates PCBs from L50 × W50mm up to L700 × W460mm, covering a wide range of product sizes from small modules to large panels.
Robust Construction: Weighing approximately 2,100 kg, the machine provides exceptional stability for sustained high-speed precision placement.
Technical Specifications
| Parameter | YSM40R |
|---|---|
| Version | 4-Beam, 4-Head Spec. (YSM40R-4) |
| Applicable PCB Size | L700 × W460mm to L50 × W50mm |
| Mounting Capability (Under Optimum Conditions) | 200,000 CPH (when using RS head) |
| Applicable Components (RS Head) | 0201mm* to □6.5mm (Height 2.0mm or less) *option |
| Applicable Components (MU Head) | 03015mm to 45×60mm (Height 15mm or less) |
| Mounting Accuracy (Under Optimum Conditions) | RS: ±35μm (25μm) Cpk≧1.0 / MU: ±40μm (30μm) |
| Number of Component Types (8mm Tape Conversion) | RS: Max. 80 feeders / MU: Max. 88 feeders / Mixed: Max. 84 feeders (RS×2 + MU×2) |
| Power Supply | 3-Phase AC 200/208/220/240/380/400/416V ±10% |
| Air Supply Source | ≥0.45 MPa, clean and dry |
| External Dimensions (excluding projections) | L1,000 × W2,100 × H1,550mm |
| Weight | Approx. 2,100 kg |
High-Precision, High-Quality: Setting the New Standard in Compact Depaneling
As electronics continue to evolve toward higher density, smaller form factors, and more irregular board geometries, conventional depaneling methods often fall short. DCT delivers an environmentally friendly, fast, precise, and reliab
le laser cutting solution—engineered to meet the demands of next-generation PCB assembly.
Stress‑Free Cutting
Even with components placed extremely close to the cut line, our laser process introduces zero mechanical stress, protecting sensitive parts and ensuring long‑term reliability.
Precise Thermal Management
We match laser type and processing parameters to the thermal characteristics of each board, significantly reducing heat‑affected zones and preventing damage to adjacent components.
Clean, Contaminant‑Free Operation
During cutting, gases and ablation byproducts are extracted in real time, minimizing contamination risk and maintaining a clean assembly environment.




