LA Series Dry Film Laminator – Precision Desktop Laminating for PCB & Substrate Manufacturing
LA Series Dry Film Laminator – Precision Desktop Laminating for PCB & Substrate Manufacturing
Product Description
The LA Series Dry Film Laminator from DCT is a professional desktop laminating system specifically engineered for high‑precision lamination of dry film photoresist and solder mask in PCB fabrication and other substrate processing applications. Designed to deliver consistent thermal lamination quality under controlled temperature and pressure, the LA series accommodates a wide variety of rigid and flexible materials including standard PCBs, flexible circuits, ceramic substrates, silicon wafers, and quartz glass.
Equipped with adjustable upper and lower pressure rollers, precision temperature control up to 200°C, and a built‑in film take‑up roller, the LA series ensures bubble‑free, wrinkle‑free lamination essential for reliable photolithography and solder mask processes. With infinitely adjustable feeding speed, easy material loading and unloading, and industrial‑grade construction, the LA series is the ideal laminator for R&D labs, small‑batch production lines, and prototyping facilities requiring dry film lamination, solder mask application, or polyimide film bonding.
Key Features
Broad Material Compatibility – Processes rigid boards, flexible PCBs, ceramic substrates, silicon wafers, and quartz glass, with dry film, solder mask, and polyimide film.
Precision Thermal Control – Accurate temperature regulation up to 200°C and stable pressure application ensure repeatable lamination quality.
Pressure Adjustment Mechanism – Upper and lower lamination rollers with adjustable pressure system guarantee bubble‑free, wrinkle‑free results.
Industrial Desktop Design – Compact benchtop construction with industrial‑grade durability, suitable for both laboratory and small‑batch production environments.
Infinitely Variable Feeding Speed – Speed adjustment from 0.2 to 1.2 m/min accommodates different film types and substrate materials.
Easy Material Handling – Convenient loading and unloading with integrated film take‑up roller (differentiates from standard office laminators).
Wide Substrate Thickness Range – Supports board thickness from 0.1 mm to 3 mm (or 0.2 mm to 3 mm per certain models), covering most PCB prototyping and pre‑production needs.
Technical Specifications
| Parameter | LA400 |
|---|---|
| Max. Lamination Width | 400 mm |
| Board Thickness Range | 0.1 – 3 mm |
| Lamination Speed | 0.2 – 1.2 m/min (infinitely adjustable) |
| Temperature Range | 20 – 200°C |
| Pressure Adjustment | Adjustable upper & lower rollers |
| Film Take‑up Roller | Built‑in |
| Power Supply | 220 VAC / 50 Hz |
| Power Consumption | 1.5 kW |
| Machine Dimensions (W × H × D) | 840 mm × 600 mm × 560 mm |
| Machine Weight | 73 kg |
| Supported Materials | PCB, flexible PCB, ceramic substrate, silicon wafer, quartz glass |
| Applicable Films | Dry film photoresist, solder mask, polyimide film |
High-Precision, High-Quality: Setting the New Standard in Compact Depaneling
As electronics continue to evolve toward higher density, smaller form factors, and more irregular board geometries, conventional depaneling methods often fall short. DCT delivers an environmentally friendly, fast, precise, and reliab
le laser cutting solution—engineered to meet the demands of next-generation PCB assembly.
Stress‑Free Cutting
Even with components placed extremely close to the cut line, our laser process introduces zero mechanical stress, protecting sensitive parts and ensuring long‑term reliability.
Precise Thermal Management
We match laser type and processing parameters to the thermal characteristics of each board, significantly reducing heat‑affected zones and preventing damage to adjacent components.
Clean, Contaminant‑Free Operation
During cutting, gases and ablation byproducts are extracted in real time, minimizing contamination risk and maintaining a clean assembly environment.
Our Equipment
Equipping projects with powerful machines
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TP Series Through‑Hole Plating Equipment – Carbon Film Metallization for PCB Prototyping
MP300 & MP300D Multilayer PCB Lamination Presses – Compact & High‑Capacity Solutions for PCB Prototyping
