EL400 & EX300 UV Exposure Units – High‑Precision Imaging Transfer for PCB & Solder Mask

EL400 & EX300 UV Exposure Units – High‑Precision Imaging Transfer for PCB & Solder Mask

Product Description

The EX Series UV Exposure Units from DCT deliver advanced line‑scan exposure technology for precise imaging transfer in PCB fabrication and related processes. Covering models EL400 and EX300, the series provides a range of processing capabilities to accommodate dry‑film photoresist exposure for single‑sided and double‑sided PCBs, as well as solder mask imaging for nameplates and hollow‑out components.

The EL400 utilizes an imported UV‑LED light source with narrow spectral bandwidth and minimal stray radiation, resulting in low thermal impact and highly accurate exposure dimensions. Its PMMA light guide plate ensures high light transmittance and excellent uniformity, supporting 25μm line/space resolution for fine‑line circuit applications.

The EX300 is equipped with a UV‑A actinic fluorescent tube and double‑sided Mylar film vacuum frame, providing reliable double‑sided exposure. With a resolution of 75μm line/space and a capacity of 120 panels per hour, the EX300 is optimized for high‑throughput PCB prototyping and small‑batch production.

Both models feature vacuum holding (≤0.6 MPa) and ergonomic benchtop designs, making the EX Series ideal for R&D labs, universities, PCB prototyping centers, and small‑scale manufacturing facilities requiring UV exposure, dry‑film photoresist imaging, or solder mask transfer with reliable, repeatable quality.

Key Features

Shared Features (Both Models)

  • Advanced Line‑Scan Technology – Ensures parallel output light for consistent exposure across the entire working area.

  • Vacuum Holding System – ≤0.6 MPa vacuum secures substrates during exposure, preventing misalignment.

  • Benchtop Compact Design – Space‑saving footprint suitable for laboratory benches and small production lines.

  • User‑Friendly Operation – Straightforward controls for quick setup and reliable day‑to‑day performance.

  • Wide Application Range – Supports dry‑film photoresist exposure for PCBs, solder mask imaging for nameplates, and hollow‑out component processing.

Model‑Specific Features

FeatureEL400EX300
Exposure TechnologyUV‑LED (进口 LED 紫外光源) – narrow spectrum, low stray radiation, minimal thermal effectUV‑A fluorescent tube – proven actinic light source for reliable photoresist exposure
Resolution Capability25μm line/space – ideal for fine‑line, high‑density circuit designs75μm line/space – suitable for standard PCB prototyping
Light UniformityPMMA light guide plate – high transmittance and uniformityDouble‑sided Mylar film vacuum frame – ensures even UV distribution
Throughput30 panels/hour – optimized for precision over speed120 panels/hour – high‑capacity for production environments
Double‑Sided ExposureSingle‑side exposure (dual‑side capable with flip operation)Integrated double‑sided exposure with Mylar film frame
Typical ApplicationHigh‑precision R&D, fine‑line circuits, solder mask imagingHigh‑volume prototyping, double‑sided PCB production

Technical Specifications

ParameterEL400EX300
Min. Resolution Line Width25 μm75 μm
Min. Resolution Line Spacing25 μm75 μm
Max. Exposure Area400 mm × 300 mm305 mm × 230 mm
Capacity (Throughput)30 PNL/h120 PNL/h
Vacuum Requirement≤0.6 MPa≤0.6 MPa
Light SourceUV LED (395 nm)UV‑A actinic fluorescent tube (365 nm)
Transparent MaterialPMMA light guide plateMylar film (vacuum frame)
Exposure TypeSingle‑side (double‑side capable with manual flip)Double‑side integrated
Power Supply220 VAC / 50 Hz220 VAC / 50 Hz
Power Consumption0.3 kW0.25 kW
Equipment Weight25 kg20.5 kg
High-Precision, High-Quality: Setting the New Standard in Compact Depaneling

As electronics continue to evolve toward higher density, smaller form factors, and more irregular board geometries, conventional depaneling methods often fall short. DCT delivers an environmentally friendly, fast, precise, and reliab

le laser cutting solution—engineered to meet the demands of next-generation PCB assembly.

Stress‑Free Cutting
Even with components placed extremely close to the cut line, our laser process introduces zero mechanical stress, protecting sensitive parts and ensuring long‑term reliability.

Precise Thermal Management

We match laser type and processing parameters to the thermal characteristics of each board, significantly reducing heat‑affected zones and preventing damage to adjacent components.

Clean, Contaminant‑Free Operation
During cutting, gases and ablation byproducts are extracted in real time, minimizing contamination risk and maintaining a clean assembly environment.

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