MP300 & MP300D Multilayer PCB Lamination Presses – Compact & High‑Capacity Solutions for PCB Prototyping
MP300 & MP300D Multilayer PCB Lamination Presses – Compact & High‑Capacity Solutions for PCB Prototyping
Product Description
The MP Series from DCT delivers high‑performance multilayer PCB lamination presses engineered specifically for R&D laboratories, academic institutions, and small‑batch production environments. The MP300 and MP300D are hydraulic benchtop presses that combine precise temperature and pressure control with robust electro‑hydraulic systems, enabling fast, repeatable prototyping of multilayer circuit boards according to industry standards.
Both models support a wide range of thermosetting and thermoplastic materials, including FR‑4, PTFE, LCP, graphite, solder resist films, and high‑frequency substrates. Whether you need a compact benchtop press for single‑panel development or a high‑capacity system for laminating up to six panels simultaneously, the MP300 and MP300D offer reliable, user‑friendly solutions for multilayer PCB lamination, rapid prototyping, and small‑batch production. Forced‑air cooling, automatic hydraulic units, and integrated process monitoring software ensure consistent quality and full process traceability.
Technical Specifications
| Parameter | MP300 | MP300D |
| Max. Layout Dimension (PCB size) | 285 mm × 205 mm | 305 mm × 230 mm |
| Max. Lamination Area | 305 mm × 230 mm | 355 mm × 280 mm |
| Max. Lamination Pressure | 300 N/cm² | 300 N/cm² |
| Max. Temperature | 300°C | 250°C |
| Simultaneous Panels Capacity | 2 panels | 6 panels |
| Max. PCB Layers | Up to 8 layers* | Up to 8 layers* |
| Lamination Time | Approx. 90 minutes** | Approx. 90 minutes** |
| Automatic Hydraulic System | Standard | Standard |
| Supported Substrate Materials | FR‑4, PTFE, LCP, Graphite, Solder resist films | FR‑4, PTFE, LCP, Graphite, Solder resist films |
| Power Supply | 220V / 50Hz | 220V / 50Hz |
| Power Consumption | 3.5 kW | 6.0 kW |
| Dimensions (W × H × D) | 550 mm × 550 mm × 700 mm | 600 mm × 600 mm × 1,330 mm |
| Equipment Weight (excl. hydraulics) | 240 kg | 450 kg |
High-Precision, High-Quality: Setting the New Standard in Compact Depaneling
As electronics continue to evolve toward higher density, smaller form factors, and more irregular board geometries, conventional depaneling methods often fall short. DCT delivers an environmentally friendly, fast, precise, and reliab
le laser cutting solution—engineered to meet the demands of next-generation PCB assembly.
Stress‑Free Cutting
Even with components placed extremely close to the cut line, our laser process introduces zero mechanical stress, protecting sensitive parts and ensuring long‑term reliability.
Precise Thermal Management
We match laser type and processing parameters to the thermal characteristics of each board, significantly reducing heat‑affected zones and preventing damage to adjacent components.
Clean, Contaminant‑Free Operation
During cutting, gases and ablation byproducts are extracted in real time, minimizing contamination risk and maintaining a clean assembly environment.
Our Equipment
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