DirectLaser SF5 Universal Laser Precision Cutting Equipment
DirectLaser SF5 Universal Laser Precision Cutting Equipment
DirectLaser SF5 classic models of S series, the equipment using the classic bridge structure, the use of X/Y axis separation motion structure, processing head moves on a stable bridge around the X direction, workpiece clamping platform moves along the Y axis back-and-forth. Two axes are independent and not interfere with each other
High-Precision, High-Quality: Setting the New Standard in Compact Depaneling
As electronics continue to evolve toward higher density, smaller form factors, and more irregular board geometries, conventional depaneling methods often fall short. DCT delivers an environmentally friendly, fast, precise, and reliab
le laser cutting solution—engineered to meet the demands of next-generation PCB assembly.
Stress‑Free Cutting
Even with components placed extremely close to the cut line, our laser process introduces zero mechanical stress, protecting sensitive parts and ensuring long‑term reliability.
Precise Thermal Management
We match laser type and processing parameters to the thermal characteristics of each board, significantly reducing heat‑affected zones and preventing damage to adjacent components.
Clean, Contaminant‑Free Operation
During cutting, gases and ablation byproducts are extracted in real time, minimizing contamination risk and maintaining a clean assembly environment.
