DirectLaser SA3 Standard Format Double Platform Laser Precision Cutting Equipment
DirectLaser SA3 Standard Format Double Platform Laser Precision Cutting Equipment
DirectLaser SA3 adopts dual-table design, which saves the loading and unloading time, and keeps the laser always in the processing state. The processing area of S3 is 350mmx500mm, which is suitable for depaneling placed PCBs, open cover film window and other processes in SMT industry. It can also be equipped with camera target pre-positioning system, saving the processing time due to target positioning.
High-Precision, High-Quality: Setting the New Standard in Compact Depaneling
As electronics continue to evolve toward higher density, smaller form factors, and more irregular board geometries, conventional depaneling methods often fall short. DCT delivers an environmentally friendly, fast, precise, and reliab
le laser cutting solution—engineered to meet the demands of next-generation PCB assembly.
Stress‑Free Cutting
Even with components placed extremely close to the cut line, our laser process introduces zero mechanical stress, protecting sensitive parts and ensuring long‑term reliability.
Precise Thermal Management
We match laser type and processing parameters to the thermal characteristics of each board, significantly reducing heat‑affected zones and preventing damage to adjacent components.
Clean, Contaminant‑Free Operation
During cutting, gases and ablation byproducts are extracted in real time, minimizing contamination risk and maintaining a clean assembly environment.
