DirectLaser SA4 – Online Laser Depaneling System for PCBA & SMT Production Lines
DirectLaser SA4 – Online Laser Depaneling System for PCBA & SMT Production Lines
Product Description
The DirectLaser SA4 from DCT is a high‑precision online laser depaneling system designed for seamless integration into SMT assembly lines. Engineered to handle a wide variety of PCBA shapes and sizes, the SA4 delivers stress‑free, clean, and accurate cutting for rigid, flexible, and rigid‑flex printed circuit boards. With a maximum working area of 350 × 350 mm and a compact footprint, the system supports three‑step track online feeding, enabling fast product changeovers through simple tooling adjustments. Fully compliant with both Chinese and European safety standards, the SA4 features a fully enclosed working area, integrated dust extraction, and MES‑ready standardized interfaces, making it an ideal solution for electronics manufacturers seeking automated depaneling, laser PCBA cutting, and SMT line integration with high reliability and ease of use.
Key Features
Online SMT Line Integration – Compact structure allows direct inline placement, supporting three‑step track feeding for continuous automated processing.
Large Working Area – 350 × 350 mm maximum processing area accommodates a wide range of PCBA panel sizes.
Stress‑Free Laser Cutting – Non‑contact process eliminates mechanical stress, ideal for components placed extremely close to the cut path.
High Material Compatibility – Suitable for rigid PCB, flexible PCB (FPC), rigid‑flex boards, aluminum‑based, copper‑based, and ceramic substrates.
Fast Product Changeover – Easy tooling installation and adjustment enable rapid switching between different PCBA shapes and production batches.
MES System Integration – Standardized communication interfaces allow seamless integration into manufacturing execution systems for full production traceability.
Safe & Enclosed Operation – Fully enclosed working area with interlock protection, compliant with CE and Chinese safety standards.
Real‑Time Dust Extraction – Integrated fume and particle exhaust system maintains a clean processing environment and prevents contamination.
User‑Friendly Operation – Conductive graphical interface reduces training time, enabling operators to master the system quickly.
High-Precision, High-Quality: Setting the New Standard in Compact Depaneling
As electronics continue to evolve toward higher density, smaller form factors, and more irregular board geometries, conventional depaneling methods often fall short. DCT delivers an environmentally friendly, fast, precise, and reliab
le laser cutting solution—engineered to meet the demands of next-generation PCB assembly.
Stress‑Free Cutting
Even with components placed extremely close to the cut line, our laser process introduces zero mechanical stress, protecting sensitive parts and ensuring long‑term reliability.
Precise Thermal Management
We match laser type and processing parameters to the thermal characteristics of each board, significantly reducing heat‑affected zones and preventing damage to adjacent components.
Clean, Contaminant‑Free Operation
During cutting, gases and ablation byproducts are extracted in real time, minimizing contamination risk and maintaining a clean assembly environment.
