HybriDo R1 – Compact Laser & Mechanical Hybrid Micro‑Machining System for PCB Laboratories
HybriDo R1 – Compact Laser & Mechanical Hybrid Micro‑Machining System for PCB Laboratories
Product Description
The HybriDo R1 from DCT is a compact, multi‑functional micro‑machining center that uniquely integrates both laser and mechanical processing capabilities into a single benchtop platform. Designed specifically for PCB laboratories, R&D centers, universities, and research institutes, the HybriDo R1 enables fast, high‑precision in‑house prototyping of diverse circuit boards without the need for chemical etching or tool‑dependent mechanical routing alone. Built on a high‑quality granite base for exceptional stability and vibration damping, the system combines a German‑manufactured high‑speed spindle with an advanced optical laser system, delivering the best of both technologies. Laser processing offers superior precision with no tool wear, lower operating cost, and the ability to create fine features with minimal thermal impact; mechanical processing provides faster material removal for thicker boards and higher throughput. This synergistic approach makes the HybriDo R1 a standout solution for small‑batch scientific research and laboratory applications where flexibility, accuracy, and speed are paramount.
Powered by DCT‘s proprietary chemical‑free S&S (Structure & Separate) process, the HybriDo R1 can produce fully functional PCBs in just minutes without burning or degrading the substrate material. RF, microwave, and high‑frequency circuits particularly benefit from the system’s exact feature dimensions, straight edges, and excellent correlation to simulation results. An integrated CCD vision system and vacuum table support precise alignment and secure holding of both rigid and flexible materials, including FPC and multilayer boards. With the included CircuitCAM 7 data processing software and DreamCreaTor 4 device driver software, the HybriDo R1 offers a complete, user‑friendly workflow from CAD design to finished prototype. The system is also notable for its outstanding cost‑performance ratio, making advanced PCB prototyping accessible to a wide range of academic and industrial users.
Key Features
Laser & Mechanical Hybrid Processing – Combines the precision of laser ablation with the speed of mechanical drilling and routing. Laser processing delivers high‑resolution features without tool wear; mechanical processing quickly removes material from thicker boards. Users can choose the optimal method for each task.
High‑Precision, Stress‑Free Laser Ablation – Infrared fiber laser (1,064 nm, 30 W) achieves a minimum line width of 0.075 mm and minimum line spacing of 0.035 mm (dependent on material and copper thickness), enabling fine, detailed circuit geometries with no mechanical stress on the board.
German High‑Speed Spindle & Automatic Tool Changer – Equipped with an 80,000 rpm German‑manufactured spindle and a fully automatic 16‑tool changer (15‑station in some configurations), the system supports fast, precise drilling and contour milling for a wide range of board materials.
Granite Base for Unmatched Stability – A high‑quality granite machine base provides superior vibration damping, thermal stability, and long‑term mechanical rigidity, ensuring consistently accurate results even during extended operation.
Chemical‑Free S&S Process – DCT‘s patented structure & separate process eliminates aggressive chemical etchants, producing PCBs in minutes without burning the substrate. This eco‑friendly method reduces waste and simplifies lab workflows.
Integrated CCD Vision & Alignment System – A built‑in CCD camera with automatic fiducial recognition shares exact positioning data between the laser and mechanical systems, enabling accurate registration and multi‑step processing with repeat positioning accuracy of ≤ ±10 μm (system‑level) and ≤ ±2 μm repeatability per engineering reference.
Vacuum Table for Flexible Materials – The integrated vacuum worktable securely holds both rigid and flexible substrates, including FPC, during processing, preventing movement and ensuring precision.
Compact Benchtop Design – With dimensions of 880 mm × 800 mm × 961 mm and a weight of just 120 kg, the HybriDo R1 fits easily into space‑constrained laboratories without sacrificing capability.
Wide Range of Applications – Capable of circuit patterning, window opening, micro‑via drilling (minimum diameter 0.2 mm), solder mask removal, contour milling, and more, all from a single machine.
Comprehensive Software Suite – Includes CircuitCAM 7 for powerful data processing and optimization, plus DreamCreaTor 4 for intuitive machine control, ensuring a seamless transition from design to finished prototype.
Safety & Clean Operation – Fully enclosed laser‑safe housing, interlock protection, and a built‑in fume extraction system (standard) maintain a clean, safe laboratory environment.
Excellent Value – Combines advanced capabilities with a highly competitive price point, offering one of the best cost‑performance ratios in the laboratory PCB prototyping market.
High-Precision, High-Quality: Setting the New Standard in Compact Depaneling
As electronics continue to evolve toward higher density, smaller form factors, and more irregular board geometries, conventional depaneling methods often fall short. DCT delivers an environmentally friendly, fast, precise, and reliab
le laser cutting solution—engineered to meet the demands of next-generation PCB assembly.
Stress‑Free Cutting
Even with components placed extremely close to the cut line, our laser process introduces zero mechanical stress, protecting sensitive parts and ensuring long‑term reliability.
Precise Thermal Management
We match laser type and processing parameters to the thermal characteristics of each board, significantly reducing heat‑affected zones and preventing damage to adjacent components.
Clean, Contaminant‑Free Operation
During cutting, gases and ablation byproducts are extracted in real time, minimizing contamination risk and maintaining a clean assembly environment.
