RapiDo Series – Direct Laser Circuit Board Prototyping Systems
RapiDo Series – Direct Laser Circuit Board Prototyping Systems

Product Description
The RapiDo Series from DCT is a family of high‑performance direct laser structuring systems engineered for rapid, in‑house PCB prototyping. Making conductive pattern generation as simple as printing, the RapiDo Series is ideal for small‑batch, multi‑variety circuit board production, with particular excellence in creating high‑accuracy geometric patterns for RF and microwave applications.
Combining high processing quality with exceptional speed, the systems are compact, reliable, and user‑friendly, offering low cost of ownership and daily operation. The RapiDo Series sets a new benchmark in cost‑performance ratio for circuit board laser processing equipment.
The RapiDo Series is built around a granite platform with a bridge structure for unmatched mechanical stability and vibration damping. It incorporates high‑precision imported servo motors with C5‑grade ball screws for smooth, accurate motion. A high‑performance digital scanning mirror combined with a vacuum adsorption platform ensures high processing efficiency and precise depth control. An intelligent CCD system provides automatic positioning and one‑key calibration for fast, convenient setup. A closed dust cover and dedicated dust extraction system automatically collect waste, making processing clean and contamination‑free.
The series is based on DCT‘s proven direct laser structuring technology, eliminating the need for graphic transfer, etching, and the associated indirect process errors. It preserves the original copper surface finish, achieving conductor geometry errors within 5 μm, making it exceptionally well‑suited for high‑speed, RF, microwave, and other demanding circuit board applications.
The RapiDo Series comprises three models – RapiDo R2, RapiDo U2, and RapiDo G2 – each optimized for different laser wavelengths to address a wide range of substrate materials and applications. All models are backed by DCT‘s CircuitCAM 7 data processing software and DreamCreaTor 3 device driver software.
Key Features
Direct Laser Structuring – Direct laser stripping of copper is simple and straightforward, freeing users from the traditional, tedious process of photoresist application, exposure, development, and chemical etching. Circuit patterns are produced on‑demand directly from CAD data.
Precision Motion System – High‑precision imported servo motors combined with C5‑grade ball screws deliver smooth, accurate motion. The granite machine base with bridge structure provides exceptional stability and vibration damping for consistent, repeatable results.
High‑Performance Scanning Mirror – Imported digital scanning mirror technology, combined with a vacuum adsorption platform, ensures high processing efficiency and precise depth control, supporting fine feature geometries.
Intelligent CCD Vision System – Automatic positioning with integrated fiducial recognition enables one‑key calibration, dramatically reducing setup time and eliminating manual alignment errors.
Clean, Contamination‑Free Processing – A closed dust cover and dedicated dust extraction system automatically collect ablation byproducts and waste, maintaining a clean working environment and protecting sensitive components.
Data‑Driven Workflow – Direct data‑driven processing avoids geometric distortion. No tooling or photoplotting is required – the equipment processes directly from Gerber, ODB++, or other standard PCB design files. This eliminates the intermediate steps of film plotting, registration, and etching, significantly shortening the prototyping cycle.
Superior Geometric Accuracy – Conductor geometry errors within 5 μm preserve the original copper surface finish, ensuring excellent impedance control and signal integrity – particularly critical for high‑frequency and microwave circuits.
Low Cost of Ownership – Low initial investment, minimal consumables, and simple daily operation make the RapiDo Series one of the most cost‑effective direct laser structuring systems available.
Comprehensive Software Suite – Includes CircuitCAM 7 for powerful data processing and optimization, plus DreamCreaTor 3 for intuitive machine control, delivering a seamless integrated workflow.
Compact Footprint – The smallest model (RapiDo R2) measures only 900 mm × 1,450 mm × 850 mm and weighs 270 kg, making it suitable for laboratory benches and space‑constrained production environments.
Technical Specifications
| Parameter | RapiDo R2 | RapiDo U2 | RapiDo G2 |
|---|---|---|---|
| Laser Specifications | |||
| Laser Wavelength | 1,064 nm (Infrared) | 355 nm (UV) | 532 nm (Green) |
| Average Output Power | 30 W | 20 W | 20 W |
| Accuracy & Motion | |||
| Repeat Positioning Accuracy | ≤ ±2 μm | ≤ ±2 μm | ≤ ±2 μm |
| System Positioning Accuracy | ≤ ±5 μm | ≤ ±5 μm | ≤ ±5 μm |
| X/Y Axis Motion Resolution | ≤ 0.5 μm | ≤ 0.5 μm | ≤ 0.5 μm |
| Scan Field Resolution | 20 μrad | 20 μrad | 20 μrad |
| Working Area | |||
| Max. Processing Area | 300 mm × 300 mm | 310 mm × 230 mm × 25 mm | 305 mm × 230 mm |
| Machine Platform | |||
| Platform Type | Granite platform, bridge structure | Granite platform, bridge structure | Granite platform, bridge structure |
| Physical Specifications | |||
| Dimensions (W × H × D) | 900 mm × 1,450 mm × 850 mm | 900 mm × 1,630 mm × 1,260 mm | 900 mm × 1,630 mm × 1,260 mm |
| Weight | 270 kg | 700 kg | 700 kg |
| Data Handling | |||
| Supported Data Formats | Gerber, HPGL, Sieb & Meier, Excellon, ODB++, DXF | Gerber, HPGL, Sieb & Meier, Excellon, ODB++, DXF | Gerber, HPGL, Sieb & Meier, Excellon, ODB++, DXF |
| Data Processing Software | CircuitCAM 7 | CircuitCAM 7 | CircuitCAM 7 |
| Machine Operating Software | DreamCreaTor 3 | DreamCreaTor 3 | DreamCreaTor 3 |
| Standard Features | |||
| Automatic Target Alignment (CCD) | Standard | Standard | Standard |
| Industrial Dust Extraction System | Standard | Standard | Standard |
| Vacuum Adsorption Platform | Standard | Standard | Standard |
| Operating Environment | |||
| Power Supply | 220 VAC / 50 Hz | 220 VAC / 50 Hz | 220 VAC / 50 Hz |
| Power Consumption | 1.7 kW | 2.2 kW | 3.0 kW |
| Ambient Temperature | 26 °C ± 4 °C | 26 °C ± 4 °C | 26 °C ± 4 °C |
High-Precision, High-Quality: Setting the New Standard in Compact Depaneling
As electronics continue to evolve toward higher density, smaller form factors, and more irregular board geometries, conventional depaneling methods often fall short. DCT delivers an environmentally friendly, fast, precise, and reliab
le laser cutting solution—engineered to meet the demands of next-generation PCB assembly.
Stress‑Free Cutting
Even with components placed extremely close to the cut line, our laser process introduces zero mechanical stress, protecting sensitive parts and ensuring long‑term reliability.
Precise Thermal Management
We match laser type and processing parameters to the thermal characteristics of each board, significantly reducing heat‑affected zones and preventing damage to adjacent components.
Clean, Contaminant‑Free Operation
During cutting, gases and ablation byproducts are extracted in real time, minimizing contamination risk and maintaining a clean assembly environment.
Our Equipment
Equipping projects with powerful machines
HybriDo R1 – Compact Laser & Mechanical Hybrid Micro‑Machining System for PCB Laboratories




