RapiDo Series: Direct Laser Circuit Board Prototyping System
RapiDo Series: Direct Laser Circuit Board Prototyping System
Product parameters
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Features
DirectLaser M3: Professional SMT Stencil Laser Cutting System | High Quality, Fast ROI
The DirectLaser M3 is a high-precision laser cutting system designed for manufacturing SMT stencils with exceptional accuracy and edge quality. Combining ease of use, quick setup, and low initial investment, it delivers a rapid return on capital—making it an ideal choice for SMT assembly lines, PCB factories, and professional stencil service providers.
Engineered to support equipment upgrades and production expansion, the M3 enables electronic manufacturing service (EMS) providers and stencil specialists to enhance capability while maintaining consistent, reliable stencil output for advanced PCB assembly.
Features
·Stable and reliable operation
·World-class software
·Top-class optical device
·Easy to use and operate
·Reliable after-sales service
Product parameters
| Technical data | DirectLaser M3 |
| Max.working area | 800mm x 600mm |
| Repetitive accuracy | ≤±2μm |
| X/Y resolution | ≤0.1μm |
| Laser wavelength | 1,070nm |
| X/Y movement system | Linear motor |
| Average laser power | ≥100W |
| Cutting thickness | 20μm~300μm |
| Platform structure | Granite base, fixed gantry structure |
| Dimension(W x H x D) | 1,480mm x 1,585mm x 1,713mm |
| Weight | Approx. 2,300kg |
| Configuration and options | DirectLaser M3 |
| Data processing software | CircuitCAM 7 Pro |
| Machine operating software | DreamCreaTor 3 |
| Automatic feeding | Optional |
| Camera automatic positioning | Included |
| Exhaust unit | Included |
| Operating ambient | DirectLaser M3 |
| Power requirements | 3 x 380V+N+PE,50Hz,3.0kW |
| Ambient temperature | 22°C±2°C |
High-Precision, High-Quality: Setting the New Standard in Compact Depaneling
As electronics continue to evolve toward higher density, smaller form factors, and more irregular board geometries, conventional depaneling methods often fall short. DCT delivers an environmentally friendly, fast, precise, and reliab
le laser cutting solution—engineered to meet the demands of next-generation PCB assembly.
Stress‑Free Cutting
Even with components placed extremely close to the cut line, our laser process introduces zero mechanical stress, protecting sensitive parts and ensuring long‑term reliability.
Precise Thermal Management
We match laser type and processing parameters to the thermal characteristics of each board, significantly reducing heat‑affected zones and preventing damage to adjacent components.
Clean, Contaminant‑Free Operation
During cutting, gases and ablation byproducts are extracted in real time, minimizing contamination risk and maintaining a clean assembly environment.
