DirectLaser SA1 Small Format Laser Depaneling Equipment

DirectLaser SA1 Small Format Laser Depaneling Equipment

High-Precision, High-Quality: Setting the New Standard in Compact Depaneling

As electronics continue to evolve toward higher density, smaller form factors, and more irregular board geometries, conventional depaneling methods often fall short. DCT delivers an environmentally friendly, fast, precise, and reliable laser cutting solution—engineered to meet the demands of next-generation PCB assembly.

Stress‑Free Cutting
Even with components placed extremely close to the cut line, our laser process introduces zero mechanical stress, protecting sensitive parts and ensuring long‑term reliability.

Precise Thermal Management
We match laser type and processing parameters to the thermal characteristics of each board, significantly reducing heat‑affected zones and preventing damage to adjacent components.

Clean, Contaminant‑Free Operation
During cutting, gases and ablation byproducts are extracted in real time, minimizing contamination risk and maintaining a clean assembly environment.

 

Features

· Directly data-driven

Driven directly from customer data, fast product turnaround

·High-level automation

Conveyor feeder option allows for easy integration into assembly lines
·Break through mechanical limits
Laser cutting replaces dies avoiding distortion and breaking through mechanical limits
·Contact free processing
Material is removed using laser light, no contact made with PCB panel eliminating stress damage
·Precise laser control
Precise, deep and micron-scale structure

Product parameters

Technical dataDirectLaser SA1
Working area350mm × 300mm
PlatformSteel frame table and servo motor
X/Y/Z resolution5μm
Reapetative accuracy±2μm
Data processing softwareCircuitCAM 7 Standard
Machine softwareDreamCreaTor 3
Automatic feedOptional
Camera postitioningOptional
Exhaust unitOptional
Dimension(W x H x D)930mm x 1,600mm x 1,270mm
WeightApprox. 580kg
Power requirements380VAC/50Hz,2.4kW
Ambient temperature22℃±2℃
High-Precision, High-Quality: Setting the New Standard in Compact Depaneling

 

As electronics continue to evolve toward higher density, smaller form factors, and more irregular board geometries, conventional depaneling methods often fall short. DCT delivers an environmentally friendly, fast, precise, and reliab

le laser cutting solution—engineered to meet the demands of next-generation PCB assembly.

Stress‑Free Cutting
Even with components placed extremely close to the cut line, our laser process introduces zero mechanical stress, protecting sensitive parts and ensuring long‑term reliability.

Precise Thermal Management

We match laser type and processing parameters to the thermal characteristics of each board, significantly reducing heat‑affected zones and preventing damage to adjacent components.

Clean, Contaminant‑Free Operation
During cutting, gases and ablation byproducts are extracted in real time, minimizing contamination risk and maintaining a clean assembly environment.

Our Equipment

Equipping projects with powerful machines

DirectLaser SA4 Online PCBA Laser Depaneling Equipment

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