TP Series Through‑Hole Plating Equipment – Carbon Film Metallization for PCB Prototyping
TP Series Through‑Hole Plating Equipment – Carbon Film Metallization for PCB Prototyping
Product Description
The TP Series Through‑Hole Plating Equipment from DCT delivers reliable carbon film (black hole) metallization for PCB prototyping, small‑batch production, and laboratory R&D. Covering models TP300, TP300P, TP350, TP350P, TP400, TP400D, and TP600D, the series provides a range of processing capacities to accommodate single‑sided, double‑sided, and multilayer boards. Utilizing an environmentally friendly black hole process – eliminating traditional electroless copper – each system features arc‑shaped anodes, reverse pulse power supplies, oscillating cathodes, air agitation, and circulation filtration to ensure uniform copper deposition, eliminate the “dog‑bone” effect, and achieve reliable interlayer conductivity down to 0.15‑0.2 mm holes. Select models offer additional plating tanks (‑D series) or enhanced pulse capabilities (‑P series) for higher throughput and precision. The TP Series is ideal for PCB labs, universities, R&D centers, and small‑scale manufacturers requiring through‑hole plating, double‑sided board metallization, and multilayer interlayer connection with a compact, benchtop‑friendly footprint.
Key Features (TP Series Common Features)
Environmentally Friendly Carbon Film Process – Black hole (colloidal carbon) technology avoids electroless copper chemistry, simplifying bath management and reducing waste.
Reverse Pulse Power Supply – Minimizes overplating at hole edges (“dog‑bone” effect), ensuring uniform copper thickness inside the barrel.
Arc‑Shaped Anode – Provides even current distribution across the entire board for consistent deposition.
Oscillating Cathode – Adjustable oscillation improves solution exchange inside drilled holes, enhancing throwing power.
Air Agitation & Circulation Filtration – Continuous mixing and filtration maintain bath uniformity and plating quality.
Integrated OSP Station – All models equipped with an organic solderability preservative (OSP) processing station for post‑plating surface protection.
Benchtop Design with Small Footprint – Compact dimensions suitable for laboratory benches and small production lines.
Wide Board Size Coverage – From 230 × 305 mm (TP300) up to 450 × 600 mm (TP600D), accommodating diverse PCB formats.
Through‑hole Reliability – Supports hole diameters down to 0.15‑0.2 mm with consistent metallization for double‑sided and multilayer boards.
High-Precision, High-Quality: Setting the New Standard in Compact Depaneling
As electronics continue to evolve toward higher density, smaller form factors, and more irregular board geometries, conventional depaneling methods often fall short. DCT delivers an environmentally friendly, fast, precise, and reliab
le laser cutting solution—engineered to meet the demands of next-generation PCB assembly.
Stress‑Free Cutting
Even with components placed extremely close to the cut line, our laser process introduces zero mechanical stress, protecting sensitive parts and ensuring long‑term reliability.
Precise Thermal Management
We match laser type and processing parameters to the thermal characteristics of each board, significantly reducing heat‑affected zones and preventing damage to adjacent components.
Clean, Contaminant‑Free Operation
During cutting, gases and ablation byproducts are extracted in real time, minimizing contamination risk and maintaining a clean assembly environment.
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