EasyDo Series – Direct Mechanical Circuit Board Prototyping Systems

EasyDo Series – Direct Mechanical Circuit Board Prototyping Systems

Product Description

 

The EasyDo Series from DCT is a line of high‑performance micro‑CNC machining centers specifically designed for direct mechanical PCB prototyping. Engineered as true computer numerical control machine tools, the EasyDo systems integrate advanced PCB processing technology, precision motion and positioning systems, and comprehensive control and software platforms. The result is a dedicated workhorse that delivers high precision, high efficiency, high automation, and exceptional flexibility—all with stable, reliable processing quality.

The EasyDo Series can be used as a complete micro‑CNC machining center for PCB prototyping, possessing all the characteristics of modern CNC equipment. It can perform drilling, milling, routing tasks, and selectively remove copper from copper‑clad laminates to create conductive traces and pads, producing a functional PCB directly from CAD design files. This direct‑from‑design workflow transforms PCB prototyping and small‑batch production, providing electronic product designers with a digital R&D environment that seamlessly matches EDA and CAD software.

By eliminating the traditional, time‑consuming processes of photoresist application, exposure, development, and chemical etching, the EasyDo Series empowers engineers to validate designs in hours rather than days. The systems are ideal for high‑performance analog, digital, HF, RF, and microwave applications, as well as for small‑batch PCB production and rapid prototyping.

The EasyDo Series comprises two models – EasyDo M1 and EasyDo M2 – offering different levels of precision, automation, and throughput to suit a wide range of laboratory, R&D, and small‑scale manufacturing requirements. All models are backed by DCT‘s CircuitCAM 7 data processing software and DreamCreaTor machine operating software, supporting Gerber, Gerber X, Excellon, Sieb & Meier, AutoCAD™ DXF, HP‑GL™, Barco, DPF, ODB++, and other industry‑standard data formats.

Key Features

Shared Features (Both Models)

  • Direct Mechanical PCB Prototyping – The EasyDo Series functions as a micro‑CNC machining center, capable of drilling, milling, routing, and selective copper removal on copper‑clad laminates. This direct mechanical approach eliminates chemical etching and graphic transfer, producing functional PCBs in hours.

  • Complete CNC Capabilities – All EasyDo systems possess the essential characteristics of modern CNC machine tools, including computer‑controlled machining, automatic tool path execution, and high‑precision motion control.

  • Integrated Processing Platform – The system combines PCB processing technology, motion and positioning systems, and control/software platforms into a single, integrated work cell—delivering high precision, high efficiency, high automation, and high flexibility with stable, reliable processing quality.

  • Seamless EDA/CAD Integration – Supports direct import of design files from popular EDA and CAD software, enabling electronic product designers to rapidly test and validate circuit designs without external fabrication delays. Supported formats include Gerber, Gerber X, Excellon, Sieb & Meier, AutoCAD™ DXF, HP‑GL™, Barco, DPF, and ODB++.

  • Broad Application Range – Ideal for high‑performance analog, digital, HF, RF, and microwave circuits, as well as small‑batch production and rapid prototyping in R&D laboratories, universities, and research institutes.

  • High‑Precision Machining – Designed to achieve fine feature geometries with high repeatability, supporting the fabrication of complex, densely populated circuit boards with excellent signal integrity.

  • Comprehensive Software Suite – Includes CircuitCAM 7 for powerful data processing and optimization, plus DreamCreaTor for intuitive machine control, delivering a seamless workflow from CAD design to finished prototype.

 

Technical Specifications

ParameterEasyDo M1EasyDo M2
Processing Capabilities
Minimum Hole Diameter0.3 mm0.15 mm
Minimum Line Width0.1 mm0.075 mm
Minimum Line Spacing0.1 mm0.1 mm
Maximum Working Area305 mm × 230 mm305 mm × 230 mm
Accuracy & Motion
Repeat Positioning Accuracy≤ ±10 μm≤ ±2 μm
System Positioning Accuracy≤ ±30 μm≤ ±10 μm
X/Y Axis Motion Resolution3 μm0.5 μm
Idle Travel Speed60 mm/s250 mm/s
Spindle
Spindle Speed40,000 rpm80,000 rpm
Spindle TypeWorld‑class manufacturer, low radial runoutWorld‑class manufacturer, low radial runout
Tool Changer TypeSemi‑automaticFully automatic (20‑tool magazine)
Tool Depth AdjustmentManualAutomatic
Throughput
Drilling Speed60 hits/min150 hits/min
Standard Equipment
Vacuum Adsorption TableStandardStandard
Camera Target Alignment (CCD)StandardStandard
Software
Data Processing SoftwareCircuitCAM 7 (Basic)CircuitCAM 7 (Standard)
Machine Operating SoftwareDreamCreaTorDreamCreaTor
Supported Data FormatsGerber, Gerber X, Excellon, Sieb & Meier, AutoCAD™ DXF, HP‑GL™, Barco, DPF, ODB++Gerber, Gerber X, Excellon, Sieb & Meier, AutoCAD™ DXF, HP‑GL™, Barco, DPF, ODB++
Optional Equipment
Industrial Silent Vacuum CleanerOptionalStandard
Control ComputerOptionalStandard
Oil‑Free Silent Air CompressorOptionalOptional
Physical Specifications
Dimensions (W × H × D)600 mm × 710 mm × 575 mm900 mm × 850 mm × 1,450 mm
Weight60 kg200 kg
Operating Environment
Power Supply220 VAC / 50 Hz220 VAC / 50 Hz
Power Consumption300 W1.6 kW
High-Precision, High-Quality: Setting the New Standard in Compact Depaneling

As electronics continue to evolve toward higher density, smaller form factors, and more irregular board geometries, conventional depaneling methods often fall short. DCT delivers an environmentally friendly, fast, precise, and reliab

le laser cutting solution—engineered to meet the demands of next-generation PCB assembly.

Stress‑Free Cutting
Even with components placed extremely close to the cut line, our laser process introduces zero mechanical stress, protecting sensitive parts and ensuring long‑term reliability.

Precise Thermal Management

We match laser type and processing parameters to the thermal characteristics of each board, significantly reducing heat‑affected zones and preventing damage to adjacent components.

Clean, Contaminant‑Free Operation
During cutting, gases and ablation byproducts are extracted in real time, minimizing contamination risk and maintaining a clean assembly environment.

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