DirectLaser SA4 Online PCBA Laser Depaneling Equipment
DirectLaser SA4 Online PCBA Laser Depaneling Equipment
DirectLaser SA4 Laser Depaneling System: Precision Cutting for SMT Production Lines
The DirectLaser SA4 is an advanced laser depaneling system designed for online processing within SMT lines. With a maximum working area of 350 x 350 mm, it handles various PCBA shapes with high precision and flexibility.
Its compact structure enables seamless integration into existing SMT production lines, facilitating quick adaptation to various board geometries. The system enables easy switching between production types through simple tooling adjustments and an efficient 3-step online feeding mechanism.
Operator-friendly by design, the SA4 features an intuitive interface that reduces training time and improves workflow efficiency. Built to comply with both Chinese and European safety standards, the system ensures reliable, secure operation with a fully enclosed working area.
Equipped with standardized interfaces, the DirectLaser SA4 can be readily integrated into Manufacturing Execution Systems (MES), providing enhanced production monitoring and control. This combination of versatility, safety, and connectivity makes it an ideal solution for modern electronics manufacturing environments.
Product parameters
| Technical data | DirectLaser SA4 |
| Max. layout area | 350mm*350mm |
| Platform | Granite Platform, Linear motor |
| Laser pulse width | Picosecond and Nanosecond |
| Laser wavelength | 355nm/532nm |
| X / Y resolution | 0.5μm |
| Repeated accuracy | ±2μm |
| System operating software | CircuitCAM7 Laser |
| Data processing software | DreamCreaTor3 |
| Automatic feeding | 3-Step track transfer |
| Camera positioning | Standard |
| Vacuum system | Standard |
| Dimension（W x H x D） | 940mm x 1,720mm x 1,650mm |
| Weight | 3×380V+N+PE, 50Hz, 3.0kW |
| Power | 22℃±2℃ |
| Ambient temperature | 1,500kg |
High-Precision, High-Quality: Setting the New Standard in Compact Depaneling
As electronics continue to evolve toward higher density, smaller form factors, and more irregular board geometries, conventional depaneling methods often fall short. DCT delivers an environmentally friendly, fast, precise, and reliab
le laser cutting solution—engineered to meet the demands of next-generation PCB assembly.
Stress‑Free Cutting
Even with components placed extremely close to the cut line, our laser process introduces zero mechanical stress, protecting sensitive parts and ensuring long‑term reliability.
Precise Thermal Management
We match laser type and processing parameters to the thermal characteristics of each board, significantly reducing heat‑affected zones and preventing damage to adjacent components.
Clean, Contaminant‑Free Operation
During cutting, gases and ablation byproducts are extracted in real time, minimizing contamination risk and maintaining a clean assembly environment.
