MP Series Multilayer Press: High-Performance Lamination for PCB Prototyping

High-Precision, High-Quality: Setting the New Standard in Compact Depaneling

As electronics continue to evolve toward higher density, smaller form factors, and more irregular board geometries, conventional depaneling methods often fall short. DCT delivers an environmentally friendly, fast, precise, and reliab

le laser cutting solution—engineered to meet the demands of next-generation PCB assembly.

Stress‑Free Cutting
Even with components placed extremely close to the cut line, our laser process introduces zero mechanical stress, protecting sensitive parts and ensuring long‑term reliability.

Precise Thermal Management

We match laser type and processing parameters to the thermal characteristics of each board, significantly reducing heat‑affected zones and preventing damage to adjacent components.

Clean, Contaminant‑Free Operation
During cutting, gases and ablation byproducts are extracted in real time, minimizing contamination risk and maintaining a clean assembly environment.