StencilMat M3 – High‑Precision Laser Cutting System for SMT Solder Paste Stencils

StencilMat M3 – High‑Precision Laser Cutting System for SMT Solder Paste Stencils

Product Description

 

The StencilMat M3 from DCT is a professional laser cutting system engineered specifically for the production of high‑quality SMT solder paste stencils. Delivering exceptionally clean, burr‑free aperture edges with sharp corners, smooth sidewalls, and a uniform microstructure, the M3 ensures the precise solder paste deposition required for reliable surface‑mount assembly.

Designed for simplicity and rapid setup, the system offers a low total cost of ownership and fast capital recovery, making it an ideal solution for SMT assembly lines and PCB factories requiring in‑house stencil production. It is equally well‑suited for professional stencil service providers and electronic manufacturing service (EMS) contractors looking to upgrade equipment and expand production capacity.

The StencilMat M3 is built on a high‑stability granite machine base with a moving‑gantry architecture, incorporating linear motors and glass scale encoders to achieve exceptional positioning accuracy. An integrated CCD camera system provides automatic fiducial alignment, ensuring accurate registration between cut features and the stencil design. The system includes DCT’s industry‑standard CircuitCAM 7 Pro data processing software and DreamCreaTor 3 driver software, delivering a fully integrated workflow from design to finished stencil.The system is capable of producing highly demanding stepped stencils (step‑down or step‑up), addressing applications where different components on the same PCB require varying solder paste volumes. For high‑volume Micro‑LED manufacturing requiring large quantities of small apertures, an optional micro‑hole acceleration module significantly improves cutting throughput.

Key Features

 

  • Superior Cutting Quality – Laser‑cut apertures exhibit sharp, distinct edges, smooth sidewalls, and a clean, uniform microstructure, promoting consistent solder paste release and print quality for reliable SMT assembly.

  • Granite Machine Base for Stability – High‑quality granite platform with moving‑gantry architecture provides outstanding vibration damping and long‑term mechanical rigidity, ensuring consistently accurate results even during extended operation.

  • High‑Precision Motion System – Linear motors with integrated glass scale encoders deliver ≤ ±2 μm positioning accuracy, ≤ ±2 μm repeat positioning accuracy, and ≤ 0.1 μm motion resolution, enabling flawless repeatability for fine‑pitch apertures.

  • Optimized Fiber Laser Source – 1,070 nm wavelength fiber laser with an average power of 200 W supports clean cutting of stainless steel stencil foils ranging from 20 μm up to 300 μm in thickness.

  • Large Format Capacity – Supports standard SMT frame sizes up to 740 mm × 950 mm × 40 mm and clamps steel sheets up to 650 mm × 850 mm, covering most industrial stencil production requirements.

  • World‑Class Software Suite – Includes CircuitCAM 7 Pro for comprehensive data processing and optimization, plus DreamCreaTor 3 for intuitive machine control, enabling seamless integration into stencil production workflows.

  • Stepped Stencil Capability – Capable of producing stepped stencils (both step‑down and step‑up), accommodating PCBs with mixed component types that require varying solder paste volumes on a single stencil.

  • Micro‑LED High‑Throughput Option – Optional micro‑hole acceleration module dramatically increases cutting speed for small apertures (30 μm – 100 μm), addressing high‑volume Micro‑LED manufacturing requirements.

  • Optional Automation Components – Can be configured with stencil inspection, stencil marking, and stencil polishing modules, forming a single‑operator automated SMT stencil production workstation.

  • CCD Camera Alignment – Standard integrated camera target alignment system ensures accurate registration between cut features and the stencil design, reducing setup time and improving yield.

  • Integrated Dust Extraction – Standard built‑in industrial exhaust system maintains a clean working environment and prevents contamination during laser processing.

  • Simple Setup & Fast ROI – Low purchase cost, straightforward installation, and rapid capital recovery make the StencilMat M3 ideal for SMT assembly lines, PCB factories, and stencil service providers.

  • User‑Friendly Operation – Intuitive interface reduces operator training time, streamlining stencil‑to‑stencil changeover for high‑mix production environments.

  • Responsive After‑Sales Support – Backed by DCT’s technical support and operator training packages, ensuring reliable long‑term operation.

Technical Specifications

ParameterStencilMat M3
Processing Area
Max. Working Area800 mm × 600 mm
Max. Frame Size740 mm × 950 mm × 40 mm
Max. Clamping Steel Sheet Size650 mm × 850 mm
Cutting Thickness Range20 μm ~ 300 μm (material‑dependent)
Accuracy & Motion System
X/Y Positioning Accuracy≤ ±2 μm
X/Y Repeat Positioning Accuracy≤ ±2 μm
X/Y Motion Resolution≤ 0.1 μm
X/Y Movement SystemLinear motors with glass scale encoders
Machine PlatformGranite machine base, moving‑gantry structure
Laser Specifications
Laser TypeFiber laser
Laser Wavelength1,070 nm
Average Laser Power200 W
Software & Control
Data Processing SoftwareCircuitCAM 7 Pro
Machine Operating SoftwareDreamCreaTor 3
CCD Vision AlignmentStandard (camera target alignment system)
Dust Extraction SystemStandard (industrial exhaust system)
Automatic Sheet Feeding SystemOptional
Physical Specifications
Machine Dimensions (W × H × D)1,480 mm × 1,585 mm × 1,713 mm
Machine Weight2,000 kg
Operating Environment
Power Supply3 × 380 V + N + PE, 50 Hz
Power Consumption3.0 kW
Ambient Temperature22 °C ± 2 °C
High-Precision, High-Quality: Setting the New Standard in Compact Depaneling

As electronics continue to evolve toward higher density, smaller form factors, and more irregular board geometries, conventional depaneling methods often fall short. DCT delivers an environmentally friendly, fast, precise, and reliab

le laser cutting solution—engineered to meet the demands of next-generation PCB assembly.

Stress‑Free Cutting
Even with components placed extremely close to the cut line, our laser process introduces zero mechanical stress, protecting sensitive parts and ensuring long‑term reliability.

Precise Thermal Management

We match laser type and processing parameters to the thermal characteristics of each board, significantly reducing heat‑affected zones and preventing damage to adjacent components.

Clean, Contaminant‑Free Operation
During cutting, gases and ablation byproducts are extracted in real time, minimizing contamination risk and maintaining a clean assembly environment.

Our Equipment

Equipping projects with powerful machines

购物车